ST Microelectronics
39 Chemin du Champ des Filles,
Geneva, 1228,
Switzerland
Geneva, 1228,
Switzerland
41 22 929 2929
Manufacturing
ST Microelectronics Technographics
ST Microelectronics Technographics, Software Purchases, AI and Digital Transformation Initiatives
Discover the latest software purchases and digital transformation initiatives being undertaken by ST Microelectronics and its business and technology executives. Each quarter our research team identifies on-prem and cloud applications that are being used by the 51370 ST Microelectronics employees from the public (Press Releases, Customer References, Testimonials, Case Studies and Success Stories) and proprietary sources.
During our research, we have identified that ST Microelectronics has purchased the following applications: SAP ERP ECC 6.0 - Accounts Receivable (AR) for AR Automation in 2018, HxGN EAM (Ex. Infor EAM) for Enterprise Asset Management in 2016, Cadence Xcelium Parallel Logic Simulation for ML and Data Science Platforms in 2017 and the related IT decision-makers and key stakeholders.
Our database provides customer insight and contextual information on which enterprise applications and software systems ST Microelectronics is running and its propensity to invest more and deepen its relationship with SAP , Hexagon , Cadence Design Systems or identify new suppliers as part of their overall Digital and IT transformation projects to stay competitive, fend off threats from disruptive forces, or comply with internal mandates to improve overall enterprise efficiency.
We have been analyzing ST Microelectronics revenues, which have grown to $16.13 billion in 2024, plus its IT budget and roadmap, cloud software purchases, aggregating massive amounts of data points that form the basis of our forecast assumptions for ST Microelectronics intention to invest in emerging technologies such as AI, Machine Learning, IoT, Blockchain, Autonomous Database or in cloud-based ERP, HCM, CRM, EPM, Procurement or Treasury applications.
ST Microelectronics Tech Stack and Enterprise Applications
ST Microelectronics ERP
Vendor |
Previous System |
Application |
Category |
Market |
VAR/SI |
When |
Live |
Insight |
|---|---|---|---|---|---|---|---|---|
| SAP | Legacy | SAP ERP ECC 6.0 - Accounts Receivable (AR) | AR Automation | ERP | n/a | 2018 | 2018 |
In 2018 ST Microelectronics implemented SAP ERP ECC 6.0 - Accounts Receivable (AR) as part of an AR Automation initiative within its finance organization. The deployment focused on accounts receivable transaction processing and standardization, with implementation activity aligned to local finance controllers and accounting specialists at sites including Napoli, Italia.
The implementation centered on SAP ERP ECC 6.0 - Accounts Receivable (AR) capabilities, covering invoicing, receivables ledger maintenance, cash application, dunning and credit management workflows typical of AR Automation. Configuration work tied AR subledger processes into SAP FI financial controls to ensure consistent general ledger posting, bank clearing for cash receipts, fixed asset related postings when billing required asset accounting, and automated intercompany posting flows.
Operational scope encompassed accounting and finance functions, with accounting specialists cooperating closely with local Finance Controllers to drive process improvements and standardization across receivables workflows. Governance emphasized procedural standardization and controlled transaction processing, and day to day operations relied on SAP FI transaction handling across account receivables, banking and intercompany modules.
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ERP Financial | ERP |
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2018 | 2018 |
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Expense Management | ERP |
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2017 | 2017 |
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ST Microelectronics ERP Services and Operations
Vendor |
Previous System |
Application |
Category |
Market |
VAR/SI |
When |
Live |
Insight |
|---|---|---|---|---|---|---|---|---|
| Hexagon | Legacy | HxGN EAM (Ex. Infor EAM) | Enterprise Asset Management | ERP Services and Operations | n/a | 2016 | 2016 |
In 2016, ST Microelectronics implemented HxGN EAM (Ex. Infor EAM) to support Enterprise Asset Management and site-level maintenance management. An internship from October 2016 to March 2017 at the Agrate Brianza, Lombardy site documented management and updating of Canopo software for personal data and the implementation of a new Canopus module already used by HR and the Central Training Office of ST Microelectronics.
HxGN EAM (Ex. Infor EAM) was used for maintenance management and configured to support standard Enterprise Asset Management workflows, including asset records, work order processing, and preventive maintenance scheduling consistent with EAM functional terminology. The Canopus module for personnel and training provided structured competence and certification records that were maintained alongside maintenance planning data.
Operational governance covered management of three emergency teams totaling 220 people, with control and verification of employee requisites under T.U. 81/2008, and personnel and training records were kept to support those compliance checks. The implementation emphasized functional alignment between maintenance operations in HxGN EAM (Ex. Infor EAM) and HR training and certification records managed via Canopus, supporting maintenance assignment and emergency team readiness at the Agrate Brianza site.
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ST Microelectronics AI Development
Vendor |
Previous System |
Application |
Category |
Market |
VAR/SI |
When |
Live |
Insight |
|---|---|---|---|---|---|---|---|---|
| Cadence Design Systems | Legacy | Cadence Xcelium Parallel Logic Simulation | ML and Data Science Platforms | AI Development | n/a | 2017 | 2017 |
In 2017, ST Microelectronics implemented Cadence Xcelium Parallel Logic Simulation to validate heterogeneous power domains interoperability for a low-power STM32 MCU. The deployment used Cadence Xcelium Parallel Logic Simulation in an ML and Data Science Platforms context to execute UPF-aware simulation and power intent verification across the MCU design.
Implementation work included authoring UPF from scratch to define five distinct power domains for the STM32 MCU. Engineers automated generation of UPF sub-parts for hardened IP power connections using Python, and developed detection routines for negedge FFs inside power domains that employ retention.
The team set up a UPF simulation flow on the Xcelium tool to exercise power-aware scenarios and incorporated UPF integrity checks using the VCLP tool as an explicit verification gate. Python-based UPF generation, VCLP integrity validation, and the Xcelium simulation runtime were composed into an orchestrated validation flow for iterative verification cycles.
Operational scope targeted low-power verification and RTL engineering teams responsible for MCU power intent, covering both hardened IP power connections and top-level domain interactions. Governance emphasized an automated UPF generation and validation pipeline with scripted checks and simulation signoff steps to standardize power intent delivery and retention verification.
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ST Microelectronics Collaboration
Vendor |
Previous System |
Application |
Category |
Market |
VAR/SI |
When |
Live |
Insight |
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Audio Video and Web Conferencing | Collaboration |
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2017 | 2017 |
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Audio Video and Web Conferencing | Collaboration |
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2020 | 2020 |
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ST Microelectronics Content Management
Vendor |
Previous System |
Application |
Category |
Market |
VAR/SI |
When |
Live |
Insight |
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Digital Asset Management | Content Management |
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2016 | 2016 |
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Digital Signing | Content Management |
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2021 | 2021 |
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ST Microelectronics CRM
Vendor |
Previous System |
Application |
Category |
Market |
VAR/SI |
When |
Live |
Insight |
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Customer Experience | CRM |
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2017 | 2017 |
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Customer Experience | CRM |
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2016 | 2016 |
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Data Management Platform | CRM |
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2016 | 2016 |
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Marketing Analytics | CRM |
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2016 | 2016 |
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Marketing Analytics | CRM |
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2016 | 2016 |
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Marketing Analytics, Lead Generation | CRM |
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2016 | 2016 |
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Marketing Automation | CRM |
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2020 | 2020 |
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Marketing Automation | CRM |
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2021 | 2021 |
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Marketing Automation | CRM |
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2016 | 2016 |
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Sales Automation, CRM, Sales Engagement | CRM |
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2015 | 2015 |
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ST Microelectronics ITSM
Vendor |
Previous System |
Application |
Category |
Market |
VAR/SI |
When |
Live |
Insight |
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Application Performance Management | ITSM |
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2016 | 2016 |
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ST Microelectronics PLM and Engineering
Vendor |
Previous System |
Application |
Category |
Market |
VAR/SI |
When |
Live |
Insight |
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Electronic Design | PLM and Engineering |
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2021 | 2021 |
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Electrostatic Discharge Simulation (ESD) | PLM and Engineering |
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2013 | 2013 |
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Multiphysics Parasitic Extraction and Analysis | PLM and Engineering |
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2010 | 2010 |
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ST Microelectronics IaaS
Vendor |
Previous System |
Application |
Category |
Market |
VAR/SI |
When |
Live |
Insight |
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Application Hosting and Computing Services | IaaS |
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2021 | 2021 |
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Application Hosting and Computing Services | IaaS |
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2016 | 2016 |
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Application Hosting and Computing Services | IaaS |
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2017 | 2017 |
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Content Delivery Network | IaaS |
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2021 | 2021 |
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Content Delivery Network | IaaS |
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2016 | 2016 |
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Content Delivery Network | IaaS |
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2017 | 2017 |
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Content Delivery Network | IaaS |
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2021 | 2021 |
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ST Microelectronics CyberSecurity
Vendor |
Previous System |
Application |
Category |
Market |
VAR/SI |
When |
Live |
Insight |
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Secure Email Gateways (SEGs) | CyberSecurity |
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2016 | 2016 |
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IT Decision Makers and Key Stakeholders at ST Microelectronics
| First Name | Last Name | Title | Function | Department | Phone | |
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| No data found | ||||||
Apps Being Evaluated by ST Microelectronics Executives
APPS RUN THE WORLD tracks software evaluation trends across 2 million companies worldwide, including buyer insights from ST Microelectronics IT executives and key decision makers. As part of ARTW Buyer Intent and technographics insights, these findings provide useful visibility into the ST Microelectronics digital transformation priorities and AI adoption trends.
| Date | Company | Status | Vendor | Product | Category | Market |
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FAQ - APPS RUN THE WORLD ST Microelectronics Technographics
ST Microelectronics is a Manufacturing organization based in Switzerland,
with around 51370 employees and annual revenues of $16.13 billion.
ST Microelectronics operates a diverse technology stack with applications such as
SAP ERP ECC 6.0 - Accounts Receivable (AR), HxGN EAM (Ex. Infor EAM) and Cadence Xcelium Parallel Logic Simulation,
covering areas like AR Automation, Enterprise Asset Management and ML and Data Science Platforms.
ST Microelectronics has invested in cloud applications and AI-driven platforms to optimize efficiency and growth,
collaborating with vendors such as SAP, Hexagon and Cadence Design Systems.
ST Microelectronics recently adopted applications including
DocuSign eSignature in 2021, Adobe Marketo in 2021 and Cadence Virtuoso in 2021,
highlighting its ongoing modernization strategy.
APPS RUN THE WORLD maintains an up-to-date database of ST Microelectronics’s key decision makers and IT executives,
available to Premium subscribers.
Our research team continuously updates ST Microelectronics’s profile with verified software purchases,
vendor relationships, and digital initiatives identified from public and proprietary sources.
Subscribe to APPS RUN THE WORLD to access the complete ST Microelectronics technographics profile,
including detailed breakdowns by category, vendor, and IT decision makers.