List of Ansys Lumerical INTERCONNECT Customers
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Since 2010, our global team of researchers has been studying Ansys Lumerical INTERCONNECT customers around the world, aggregating massive amounts of data points that form the basis of our forecast assumptions and perhaps the rise and fall of certain vendors and their products on a quarterly basis.
Each quarter our research team identifies companies that have purchased Ansys Lumerical INTERCONNECT for Optical Simulation and Design from public (Press Releases, Customer References, Testimonials, Case Studies and Success Stories) and proprietary sources, including the customer size, industry, location, implementation status, partner involvement, LOB Key Stakeholders and related IT decision-makers contact details.
Companies using Ansys Lumerical INTERCONNECT for Optical Simulation and Design include: Hewlett Packard Enterprise, a United States based Professional Services organisation with 61000 employees and revenues of $30.13 billion, AIM Photonics, a United States based Manufacturing organisation with 300 employees and revenues of $321.0 million, Fraunhofer Heinrich-Hertz-Institut Germany, a Germany based Non Profit organisation with 410 employees and revenues of $55.0 million and many others.
Contact us if you need a completed and verified list of companies using Ansys Lumerical INTERCONNECT, including the breakdown by industry (21 Verticals), Geography (Region, Country, State, City), Company Size (Revenue, Employees, Asset) and related IT Decision Makers, Key Stakeholders, business and technology executives responsible for the software purchases.
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| Logo | Customer | Industry | Empl. | Revenue | Country | Vendor | Application | Category | When | SI | Insight |
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AIM Photonics | Manufacturing | 300 | $321M | United States | Ansys Inc. | Ansys Lumerical INTERCONNECT | Optical Simulation and Design | 2019 | n/a |
In 2019, AIM Photonics implemented Ansys Lumerical INTERCONNECT, Apps Category , by delivering a statistically enabled compact model library called AIM CML in collaboration with Analog Photonics and Ansys to support multi-project wafer manufacturing services. The implementation positioned Ansys Lumerical INTERCONNECT as the simulation platform for Monte Carlo yield and design for manufacturability analyses within the AIM Photonics workflow.
The deployment integrated the AIM CML into Ansys Lumerical INTERCONNECT to enable parametric and statistical behavioral modeling of photonic integrated circuit components, supporting Monte Carlo yield runs and DFM-focused simulation sweeps. Functional capability emphasis centered on compact model consumption, statistical parameter distribution injection, and system-level photonic netlist simulation within the INTERCONNECT environment.
Operational coverage targeted U.S. R&D and manufacturing enablement at NY CREATES, with the solution used to assess manufacturability and to reduce design risk for photonic integrated circuits produced through AIM Photonics MPW services. Governance and rollout focused on a collaborative library handoff and validation cycle between AIM Photonics, Analog Photonics, and Ansys, with INTERCONNECT cited explicitly as the simulation platform driving yield and DFM analyses.
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Fraunhofer Heinrich-Hertz-Institut Germany | Non Profit | 410 | $55M | Germany | Ansys Inc. | Ansys Lumerical INTERCONNECT | Optical Simulation and Design | 2018 | n/a |
In 2018 Fraunhofer Heinrich-Hertz-Institut implemented Ansys Lumerical INTERCONNECT for Photonic design and simulation to develop and calibrate an indium phosphide foundry SOA compact model. The deployment was focused within the Germany based R and D and foundry groups, aligning simulation workflows with foundry process characterization to supply compact models to PIC designers.
Ansys Lumerical INTERCONNECT was used for parameter extraction and validation, enabling the creation of foundry calibrated compact model libraries for photonic integrated circuit design. Functional emphasis centered on compact model extraction, device level parameterization, and validation workflows, with INTERCONNECT serving as the simulation and parameter extraction engine credited in the case study.
Operational coverage encompassed foundry engineers and PIC design teams, with configuration workstreams that linked measured device characterization to compact model tuning and library curation. The implementation supported model handoff and library distribution to designers, embedding calibrated compact models into the design verification loop for photonic integrated circuits.
Governance was structured as a collaborative calibration program between Fraunhofer HHI and Ansys Lumerical, with iterative validation cycles to align model parameters to foundry process data. The case study explicitly credits Ansys Lumerical INTERCONNECT for enabling parameter extraction and validation, and reports improved model accuracy to reduce prototyping cycles and accelerate time to market.
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Hewlett Packard Enterprise | Professional Services | 61000 | $30.1B | United States | Ansys Inc. | Ansys Lumerical INTERCONNECT | Optical Simulation and Design | 2022 | n/a |
In 2022, Hewlett Packard Enterprise implemented Ansys Lumerical INTERCONNECT at HP Labs in the United States to support an integrated electronic-photonic co-simulation workflow, Apps Category . The deployment targeted R&D and design engineering teams focused on dense WDM silicon photonics ring-resonator device development, with Ansys Lumerical INTERCONNECT used to model and simulate photonic circuit behavior.
The implementation emphasized multiphysics capability, explicitly combining thermal analysis and electrical to optical simulation to capture device interactions. Ansys Lumerical INTERCONNECT was configured to support ring-resonator optimization workflows, enabling bit-error-rate validation and iterative design refinement within the simulation environment.
Operational scope was confined to HP Labs research and development activities in the United States, where the tool was used as part of a larger co-simulation pipeline to align electronic drivers and photonic components. The workflow integration focused on linking circuit level photonic simulation outputs to thermal and electrical constraints, improving design fidelity before fabrication.
Governance and rollout remained within the R&D organization, with usage described as a design and validation capability rather than a company wide production system. Outcomes reported in the case study include improved design accuracy, reduced need for re-spins, shortened time-to-market, and validated bit-error-rate targets using Ansys Lumerical INTERCONNECT.
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