List of Ansys Electronics Desktop (AEDT) Customers
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Since 2010, our global team of researchers has been studying Ansys Electronics Desktop (AEDT) customers around the world, aggregating massive amounts of data points that form the basis of our forecast assumptions and perhaps the rise and fall of certain vendors and their products on a quarterly basis.
Each quarter our research team identifies companies that have purchased Ansys Electronics Desktop (AEDT) for Computer-Aided Design (CAD) from public (Press Releases, Customer References, Testimonials, Case Studies and Success Stories) and proprietary sources, including the customer size, industry, location, implementation status, partner involvement, LOB Key Stakeholders and related IT decision-makers contact details.
Companies using Ansys Electronics Desktop (AEDT) for Computer-Aided Design (CAD) include: Eaton India, a India based Manufacturing organisation with 10000 employees and revenues of $2.00 billion, Ampleon, a Netherlands based Manufacturing organisation with 1200 employees and revenues of $450.0 million, SuperGrid Institute, a France based Utilities organisation with 150 employees and revenues of $9.0 million and many others.
Contact us if you need a completed and verified list of companies using Ansys Electronics Desktop (AEDT), including the breakdown by industry (21 Verticals), Geography (Region, Country, State, City), Company Size (Revenue, Employees, Asset) and related IT Decision Makers, Key Stakeholders, business and technology executives responsible for the software purchases.
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| Logo | Customer | Industry | Empl. | Revenue | Country | Vendor | Application | Category | When | SI | Insight |
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Ampleon | Manufacturing | 1200 | $450M | Netherlands | Ansys Inc. | Ansys Electronics Desktop (AEDT) | Computer-Aided Design (CAD) | 2019 | n/a |
In 2019, Ampleon implemented Ansys Electronics Desktop (AEDT) in its Netherlands R&D organization. Ampleon uses Ansys Electronics Desktop with HFSS, Icepak and Mechanical via Workbench for electromagnetic, thermal and electro-thermo-mechanical multiphysics simulation of RF power devices and packages, and the Apps Category is .
Functional configuration centers on HFSS for system-level electromagnetic modeling, Icepak for thermal-fluid analysis, and Mechanical accessed through Ansys Workbench for structural and electro-thermo-mechanical coupling. Simulation workflows support device and package-level modeling, parametric trade studies, and coupled multiphysics runs to evaluate electromagnetic and thermal interactions during iterative design cycles.
The deployment is scoped to Ampleon R&D in the Netherlands and is used by product engineering, packaging, thermal management, and reliability teams to inform design decisions. Simulations produced by Ansys Electronics Desktop enable earlier system-level EM and thermal trade-offs, and Ampleon reports these capabilities help reduce time-to-market and redesign cycles by surfacing performance and reliability issues earlier in product development.
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Eaton India | Manufacturing | 10000 | $2.0B | India | Ansys Inc. | Ansys Electronics Desktop (AEDT) | Computer-Aided Design (CAD) | 2022 | n/a |
In 2022 Eaton India implemented Ansys Electronics Desktop (AEDT) to support EMI/EMC and system-level electromagnetic analysis, deploying the Ansys Electronics Desktop (AEDT) suite at its India Innovation Center. The implementation focused on identifying emission and susceptibility risks earlier in product development for EV charger, UPS and power-electronics designs, aligning the application with the EMI/EMC and system-level electromagnetic analysis category.
The deployment emphasized functional capabilities for emission prediction, susceptibility assessment and system-level electromagnetic modeling, enabling engineers to simulate board-level and enclosure interactions within the same environment. Configuration centered on engineering workstation installations and CAD to EM model preparation workflows, embedding AEDT analysis runs into existing design validation sequences.
Operational coverage included R&D and hardware engineering teams at the India Innovation Center, targeting product families for electric vehicle charging, uninterruptible power supplies and power-electronics modules. Integrations were implemented at the process level to feed simulation findings into design review cycles and prototype decision points, improving upstream detection of EMI/EMC issues.
Governance and rollout emphasized earlier-stage simulation gates in the design lifecycle and tighter collaboration between simulation engineers and hardware designers, reducing downstream prototyping. The implementation enabled earlier detection of EMI/EMC issues, reduced design iterations and prototyping effort and accelerated design-cycle time from an EMI/EMC perspective, consistent with the stated outcomes.
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SuperGrid Institute | Utilities | 150 | $9M | France | Ansys Inc. | Ansys Electronics Desktop (AEDT) | Computer-Aided Design (CAD) | 2014 | n/a |
In 2014 SuperGrid Institute deployed Ansys Electronics Desktop (AEDT) within an Engineering simulation environment to support engineering and R&D functions for MV/HV DC power-converter development in France. The implementation places Ansys Electronics Desktop (AEDT) at the center of a multiphysics workflow combining Maxwell, Q3D, Icepak, and Twin Builder to accelerate virtual validation and reduce physical prototyping cycles.
The configuration leverages electromagnetic field solvers, electrothermal coupling and system-level modeling across the named Ansys products, with model setup and parameterized simulation experiments used to iterate converter designs. Functional capabilities implemented include 3D EM simulation, parasitic extraction, thermal analysis and co-simulation with system models to validate power converter behavior under MV and HV DC operating conditions.
Operational scope focused on engineering and R&D teams at SuperGrid Institute in France, embedding Ansys Electronics Desktop (AEDT) into product development workflows and troubleshooting practices. Integrations are explicit within the Ansys multiphysics stack, enabling data handoffs between Maxwell, Q3D, Icepak and Twin Builder as part of the same simulation chain.
Governance and process changes centered on standardized simulation models and repeatable validation procedures to shorten response times to customer requirements. The Ansys case study reports an estimated 50 to 70 percent faster response to specific customer needs and faster troubleshooting in engineering and R&D processes.
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