List of ANSYS Q3D Extractor Customers
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United States
Since 2010, our global team of researchers has been studying ANSYS Q3D Extractor customers around the world, aggregating massive amounts of data points that form the basis of our forecast assumptions and perhaps the rise and fall of certain vendors and their products on a quarterly basis.
Each quarter our research team identifies companies that have purchased ANSYS Q3D Extractor for Multiphysics Parasitic Extraction and Analysis from public (Press Releases, Customer References, Testimonials, Case Studies and Success Stories) and proprietary sources, including the customer size, industry, location, implementation status, partner involvement, LOB Key Stakeholders and related IT decision-makers contact details.
Companies using ANSYS Q3D Extractor for Multiphysics Parasitic Extraction and Analysis include: Qualcomm, a United States based Manufacturing organisation with 52000 employees and revenues of $44.28 billion, ST Microelectronics, a Switzerland based Manufacturing organisation with 51370 employees and revenues of $16.13 billion, NXP Semiconductors, a Netherlands based Manufacturing organisation with 34200 employees and revenues of $13.21 billion and many others.
Contact us if you need a completed and verified list of companies using ANSYS Q3D Extractor, including the breakdown by industry (21 Verticals), Geography (Region, Country, State, City), Company Size (Revenue, Employees, Asset) and related IT Decision Makers, Key Stakeholders, business and technology executives responsible for the PLM and Engineering software purchases.
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| Logo | Customer | Industry | Empl. | Revenue | Country | Vendor | Application | Category | When | SI | Insight |
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NXP Semiconductors | Manufacturing | 34200 | $13.2B | Netherlands | Ansys Inc. | ANSYS Q3D Extractor | Multiphysics Parasitic Extraction and Analysis | 2015 | n/a |
In 2015, NXP Semiconductors implemented ANSYS Q3D Extractor as part of its electromagnetic analysis toolset to support the SAF360x digital radio IC program, aligning with the Electromagnetic, Circuit and System Simulation category. The deployment targeted electromagnetic modeling needs for a novel multi-radio, multi-die integration effort that required early parasitic awareness and signal integrity checks during IC and package design.
ANSYS Q3D Extractor was used for 3D electromagnetic field simulation and parasitic extraction, including capacitance and inductance extraction and coupling analysis for multi-die and package structures. The implementation emphasized model generation that could be consumed by circuit-level flows, enabling electrical representation of extracted parasitics for downstream simulation and design rule validation.
The Q3D Extractor implementation was used in conjunction with ANSYS RedHawk electronics simulation software for co-analysis of signal integrity and power integrity, creating a workflow to identify and reduce analog to digital interference across mixed-signal blocks. Operational coverage included RF, mixed-signal IC design, and package engineering teams responsible for the SAF360x family, integrating electromagnetic extraction into existing electronic design automation flows.
Governance centered on embedding electromagnetic extraction into design iteration gates and verification checklists for the SAF360x program, standardizing early-stage SI and PI verification within chip and package design cycles. The combined use of ANSYS Q3D Extractor and ANSYS RedHawk supported NXP Semiconductors in producing the SAF360x series that integrated three radio standards and up to six ICs into a single IC with a footprint reported as 75 percent smaller and improved cost effectiveness, while minimizing analog digital interference.
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Qualcomm | Manufacturing | 52000 | $44.3B | United States | Ansys Inc. | ANSYS Q3D Extractor | Multiphysics Parasitic Extraction and Analysis | 2010 | n/a |
In 2010 Qualcomm implemented ANSYS Q3D Extractor for Electromagnetic, Circuit and System Simulation while developing and testing In Cell prototype touch sensors to demonstrate feasibility in MEMS displays. Qualcomm used ANSYS Q3D Extractor as the primary tool for extensive electromagnetic modeling and parasitic extraction during prototype development.
The implementation leveraged 3D field solver workflows in ANSYS Q3D Extractor, including capacitance and inductance extraction, dense meshing of sensor and display interconnect geometries, and generation of compact parasitic networks for circuit level co simulation. Model export and parameterized sweeps were used to iterate design variants and to feed extracted parasitics into system level signal integrity and touch sensor sensitivity analyses.
Operational coverage focused on Qualcomm R and D and engineering teams engaged in MEMS display prototyping, with modeling activities embedded in iterative build and test cycles. Governance emphasized model validation against lab measurements and versioned extraction artifacts to support reproducible prototype testing, enabling Qualcomm to demonstrate feasibility of In Cell touch sensors in MEMS displays.
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ST Microelectronics | Manufacturing | 51370 | $16.1B | Switzerland | Ansys Inc. | ANSYS Q3D Extractor | Multiphysics Parasitic Extraction and Analysis | 2010 | n/a |
In 2010 ST Microelectronics implemented ANSYS Q3D Extractor to support package electrical modeling and simulation within its engineering workflow. The deployment targeted Electromagnetic, Circuit and System Simulation use cases for package parasitic extraction and EM field analysis across packaging engineering and signal integrity teams.
ANSYS Q3D Extractor was used to perform quasi static and full wave electromagnetic simulations, providing capacitance, inductance and resistance extraction and enabling netlist-level models for downstream circuit simulation. The implementation emphasized solver configuration for both quasi static and full wave EM solver modes, aligning simulation setup with package geometry and multi conductor routing typical of IC package and board interconnects.
Modeling and simulation activities were performed using Ansoft Q3D Extractor, Turbo Package Analyzer TPA and Apache Sentinel NPE PakSi-E in a combined workflow, with model and data exchange between tools to validate package electrical behavior. These tool sets were applied to package electrical modeling, signal integrity and power integrity simulations, creating an interoperable EM analysis chain for package design verification.
Governance focused on embedding simulation driven checks into packaging and signal integrity engineering processes, standardizing solver configurations and model export formats to support consistent analysis. ANSYS Q3D Extractor served as the core EM extraction engine in the Electromagnetic, Circuit and System Simulation stack, enabling engineers to produce extraction data for circuit level validation and iterative package design refinement.
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Buyer Intent: Companies Evaluating ANSYS Q3D Extractor
- Rrys United States, a United States based Professional Services organization with 10 Employees
Discover Software Buyers actively Evaluating Enterprise Applications
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