List of Cadence EDA in the Cloud Customers
Cadence Design Systems
2655 Seely Avenue, Building 5,
San Jose, 95134, CA,
United States
San Jose, 95134, CA,
United States
1 408-943-1234
Professional Services
13800
$5.3B
Since 2010, our global team of researchers has been studying Cadence EDA in the Cloud customers around the world, aggregating massive amounts of data points that form the basis of our forecast assumptions and perhaps the rise and fall of certain vendors and their products on a quarterly basis.
Each quarter our research team identifies companies that have purchased Cadence EDA in the Cloud for Electronic Design from public (Press Releases, Customer References, Testimonials, Case Studies and Success Stories) and proprietary sources, including the customer size, industry, location, implementation status, partner involvement, LOB Key Stakeholders and related IT decision-makers contact details.
Companies using Cadence EDA in the Cloud for Electronic Design include: Toshiba, a Japan based Manufacturing organisation with 116224 employees and revenues of $30.27 billion, Infineon Technologies, a Germany based Manufacturing organisation with 53599 employees and revenues of $13.86 billion, Renesas Electronics, a Japan based Manufacturing organisation with 22711 employees and revenues of $8.84 billion, HiSilicon China, a China based Manufacturing organisation with 7000 employees and revenues of $8.30 billion, Tezzaron, a United States based Professional Services organisation with 160 employees and revenues of $26.0 million and many others.
Contact us if you need a completed and verified list of companies using Cadence EDA in the Cloud, including the breakdown by industry (21 Verticals), Geography (Region, Country, State, City), Company Size (Revenue, Employees, Asset) and related IT Decision Makers, Key Stakeholders, business and technology executives responsible for the PLM and Engineering software purchases.
The Cadence EDA in the Cloud customer wins are being incorporated in our Enterprise Applications Buyer Insight and Technographics Customer Database which has over 100 data fields that detail company usage of PLM and Engineering software systems and their digital transformation initiatives. Apps Run The World wants to become your No. 1 technographic data source!
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| Logo | Customer | Industry | Empl. | Revenue | Country | Vendor | Application | Category | When | SI | Insight |
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HiSilicon China | Manufacturing | 7000 | $8.3B | China | Cadence Design Systems | Cadence EDA in the Cloud | Electronic Design | 2016 | n/a |
In 2016, HiSilicon China implemented Cadence EDA in the Cloud as part of a targeted adoption of the Cadence Innovus implementation system for production DSP designs, aligning the project explicitly with Electronic Design workflows. The implementation centered on applying the Cadence Innovus implementation system to HiSilicon production DSP blocks, positioning Cadence EDA in the Cloud as the core physical implementation environment used by the chip design organization. This placement establishes a clear Company Application Category Business Function relationship, HiSilicon China Cadence EDA in the Cloud Electronic Design physical implementation for DSP designs.
The deployment emphasized physical implementation capabilities common to the Electronic Design category, including placement and routing, timing closure and optimization, and power aware implementation for DSP macros and blocks. Cadence EDA in the Cloud was provisioned to support concurrent physical design runs and iterative timing analysis, enabling the Innovus implementation flows to operate within cloud-scaled compute and storage while retaining centralized design database access. Configuration focused on integrating Innovus implementation flows into HiSilicon's RTL to GDSII orchestration, and on standardizing tool flows for production DSP design signoff.
Operational coverage targeted HiSilicon's semiconductor physical design and implementation teams, embedding Cadence Innovus based flows into production tapeout processes for DSP designs and into engineering change control for chip signoff. Governance concentrated on formalizing implementation signoff checkpoints and design handoff procedures between front end design and physical implementation, ensuring Cadence EDA in the Cloud was the authoritative implementation platform within HiSilicon's Electronic Design practice. No system integrator was specified in the source, and the narrative reflects implementation architecture, modules, and operational scope as stated.
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Infineon Technologies | Manufacturing | 53599 | $13.9B | Germany | Cadence Design Systems | Cadence EDA in the Cloud | Electronic Design | 2019 | n/a |
In 2019, Infineon Technologies deployed Cadence EDA in the Cloud to support its Electronic Design activities for analog and mixed-signal development. The deployment was positioned to institutionalize continuous improvements to tools and processes, with explicit ownership assigned to a Staff Engineer Analog Design Methodology for schematic entry and Design System maintenance.
Cadence EDA in the Cloud implementation centers on analog generator workflows for front end and back end design, netlisting tools producing cdl and Verilog outputs, and automated test bench generation using ADE XL capabilities. The environment includes support for the Cadence Virtuoso Software Suite and Cadence EAD, and extends to in-house software developed with SKILL, TCL, Perl and Python to instrument AMS circuit design flows.
Operational architecture integrates cloud-hosted EDA tooling with Unix and Linux workstations and existing LSF server farms for batch job queuing and simulation throughput. The implementation maintains direct vendor and customer touchpoints worldwide to ensure toolchain alignment with external IP and foundry requirements, while keeping Cadence Virtuoso and Cadence EAD as core integrated authoring and verification interfaces.
Governance and process responsibilities were defined around Design System development and maintenance, ongoing debugging of netlisting tools, and ownership of testbench generation and support processes. The role emphasizes cross-functional collaboration across analog design teams, tool developers and external vendors, and aligns with Infineon’s Technical Ladder career path for engineering leadership and methodology stewardship.
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Renesas Electronics | Manufacturing | 22711 | $8.8B | Japan | Cadence Design Systems | Cadence EDA in the Cloud | Electronic Design | 2018 | n/a |
In 2018, Renesas Electronics provisioned Cadence EDA in the Cloud to support Electronic Design activities within its Infra Power Design Department, addressing mixed signal IC work for monolithic Smart Power Stage products. The deployment was tied to Hardware Engineering functions in Takasaki and intended to strengthen circuit design and verification capacity for high current DCDC converters, amplifiers, protection circuits and interface circuits.
The implementation centered on cloud-hosted Cadence design tools to enable schematic capture, physical layout, mixed signal simulation and verification flows, and automated design rule checks consistent with an Electronic Design toolchain. Configurations emphasized mixed signal IC design flows and lab test orchestration, with access controls and design data management to support concurrent design and verification work by lead analog designers and verification engineers.
Operability was integrated with physical lab evaluation workflows, as teams used Cadence EDA in the Cloud outputs to drive prototype sample testing and bench evaluation of DCDC converters. The project explicitly supported cross-border collaboration, connecting the Japan design team with USA IPDD design and marketing counterparts, and enabling communication between design engineers and application engineers in support of product development across infrastructure, IoT and mobile segments.
Governance and rollout focused on embedding a lead Analog Design Engineer role to centralize circuit design ownership, establish global communication practices in English and Japanese, and align design verification and bench test handoffs. The implementation prioritized reproducible mixed signal workflows and cloud access patterns to support remote collaboration and iterative prototype evaluation without reference to any prior system name.
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Tezzaron | Professional Services | 160 | $26M | United States | Cadence Design Systems | Cadence EDA in the Cloud | Electronic Design | 2016 | n/a |
In 2016, Tezzaron implemented Cadence EDA in the Cloud to support networking and supercomputing system on chip SoC development. Tezzaron, known for 3D ICs and advanced memory devices, incorporated the Cadence full-flow digital RTL to signoff solution into its engineering toolchain, an adoption the company reported as cutting development schedules in half.
The deployment delivered an end to end Electronic Design flow, with implementations of RTL synthesis, logic implementation, physical design including place and route, static timing analysis and signoff verification consistent with a full flow digital toolchain. Cadence EDA in the Cloud was operated as cloud hosted EDA tool instances with distributed compute for large scale simulation and flow orchestration, enabling engineers to run extensive synthesis and timing signoff runs without expanding on premise compute capacity.
Operational scope focused on SoC design and verification engineering teams working on networking and supercomputing chips, embedding Cadence tools from project inception to standardize workflows and accelerate iteration cycles. Governance emphasized adoption of full flow digital practices across design stages, with the Electronic Design deployment framed around engineering productivity and shortened development schedules as the primary reported outcome.
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Toshiba | Manufacturing | 116224 | $30.3B | Japan | Cadence Design Systems | Cadence EDA in the Cloud | Electronic Design | 2016 | n/a |
In 2016, Toshiba implemented Cadence EDA in the Cloud for a production mobile memory controller design project, deploying the Cadence Innovus Implementation System within its Electronic Design function. The implementation targeted physical implementation workflows inside Toshiba's Storage & Electronic Devices Solutions Company, with direct engagement from the Mixed Signal IC Division for production designs.
The deployment leveraged the Innovus Implementation System's GigaPlace solver-based placement, GigaOpt low-power optimization and CCOpt concurrent clock and datapath optimization engines to focus on place and route for random logic and low-power objectives. Cadence Innovus was used for multi-threaded and distributed computing execution, exploiting its massively parallel architecture to accelerate core algorithms and throughput. Toshiba integrated its own custom libraries into the Innovus toolflow to meet aggressive power and area constraints during physical implementation.
Operational coverage emphasized placement, routing and low-power optimization stages of the physical design flow for mobile memory controllers, with the implementation applied to production design and verification cycles and planned extension to additional product designs. The configuration supported production implementation workflows and tighter place and route turnaround due to parallelization and distributed compute capacity.
Governance and vendor collaboration centered on close technical collaboration with Cadence around tool tuning and library integration, and Toshiba reported achieving a 16 percent smaller place and route area for random logic and 25 percent lower power consumption, together with shorter P&R turnaround time. Toshiba stated it would apply the Innovus Implementation System to other product designs based on these results, aligning Electronic Design engineering practices to the new toolchain.
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Buyer Intent: Companies Evaluating Cadence EDA in the Cloud
ARTW Buyer Intent uncovers actionable customer signals, identifying software buyers actively evaluating Cadence EDA in the Cloud. Gain ongoing access to real-time prospects and uncover hidden opportunities. Companies Actively Evaluating Cadence EDA in the Cloud for Electronic Design include:
- Bharti Tele Ventures, a India based Communications organization with 100 Employees
- Northrop Grumman, a United States based Aerospace and Defense company with 97000 Employees
- Indiana University, a United States based Education organization with 21100 Employees
Discover Software Buyers actively Evaluating Enterprise Applications
| Logo | Company | Industry | Employees | Revenue | Country | Evaluated |
|---|---|---|---|---|---|---|
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Bharti Tele Ventures | Communications | 100 | $10M | India | 2025-11-14 |
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Northrop Grumman | Aerospace and Defense | 97000 | $41.0B | United States | 2024-10-10 |
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Indiana University | Education | 21100 | $2.5B | United States | 2024-08-03 |
FAQ - APPS RUN THE WORLD Cadence EDA in the Cloud Coverage
Cadence EDA in the Cloud is a Electronic Design solution from Cadence Design Systems.
Companies worldwide use Cadence EDA in the Cloud, from small firms to large enterprises across 21+ industries.
Organizations such as Toshiba, Infineon Technologies, Renesas Electronics, HiSilicon China and Tezzaron are recorded users of
Cadence EDA in the Cloud for Electronic Design.
Companies using Cadence EDA in the Cloud are most concentrated in Manufacturing and Professional Services, with adoption spanning over 21 industries.
Companies using Cadence EDA in the Cloud are most concentrated in Japan, Germany and China, with adoption tracked across 195 countries worldwide. This global distribution highlights the popularity of Cadence EDA in the Cloud across Americas, EMEA, and APAC.
Companies using Cadence EDA in the Cloud range from small businesses with 0-100 employees - 0%, to mid-sized firms with 101-1,000 employees - 20%, large organizations with 1,001-10,000 employees - 20%, and global enterprises with 10,000+ employees - 60%.
Customers of Cadence EDA in the Cloud include firms across all revenue levels — from $0-100M, to $101M-$1B, $1B-$10B, and $10B+ global corporations.
Contact APPS RUN THE WORLD to access the full verified Cadence EDA in the Cloud customer database with detailed Firmographics such as industry, geography, revenue, and employee breakdowns as well as key decision makers in charge of Electronic Design.