List of Cadence Interconnect Workbench Customers
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Since 2010, our global team of researchers has been studying Cadence Interconnect Workbench customers around the world, aggregating massive amounts of data points that form the basis of our forecast assumptions and perhaps the rise and fall of certain vendors and their products on a quarterly basis.
Each quarter our research team identifies companies that have purchased Cadence Interconnect Workbench for Electronic Design, System on Chip Design from public (Press Releases, Customer References, Testimonials, Case Studies and Success Stories) and proprietary sources, including the customer size, industry, location, implementation status, partner involvement, LOB Key Stakeholders and related IT decision-makers contact details.
Companies using Cadence Interconnect Workbench for Electronic Design, System on Chip Design include: Renesas Electronics, a Japan based Manufacturing organisation with 22711 employees and revenues of $8.84 billion, Arm Holdings, a United Kingdom based Professional Services organisation with 8330 employees and revenues of $4.01 billion and many others.
Contact us if you need a completed and verified list of companies using Cadence Interconnect Workbench, including the breakdown by industry (21 Verticals), Geography (Region, Country, State, City), Company Size (Revenue, Employees, Asset) and related IT Decision Makers, Key Stakeholders, business and technology executives responsible for the software purchases.
The Cadence Interconnect Workbench customer wins are being incorporated in our Enterprise Applications Buyer Insight and Technographics Customer Database which has over 100 data fields that detail company usage of software systems and their digital transformation initiatives. Apps Run The World wants to become your No. 1 technographic data source!
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| Logo | Customer | Industry | Empl. | Revenue | Country | Vendor | Application | Category | When | SI | Insight |
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Arm Holdings | Professional Services | 8330 | $4.0B | United Kingdom | Cadence Design Systems | Cadence Interconnect Workbench | Electronic Design,System on Chip Design | 2015 | n/a |
In 2015, Arm Holdings and Cadence Design Systems demonstrated Cadence Interconnect Workbench integrated with Arm CoreLink System IP. The engagement targeted Electronic Design,System on Chip Design workflows, aiming to provide SoC designers with regionally global capabilities for performance characterization, architecture exploration, and PPA improvements.
The demonstration emphasized Cadence Interconnect Workbench capabilities for interconnect modeling and performance analysis, enabling architecture exploration across transaction level interconnect topologies and supporting performance characterization, latency and throughput profiling, and power performance area considerations. Cadence Interconnect Workbench was shown instrumented against CoreLink System IP models to surface interconnect behavior relevant to early stage architecture tradeoffs.
Integration was executed as a joint demo and validation between Arm and Cadence, with data flows demonstrated between the Interconnect Workbench and Arm CoreLink System IP. Operational scope was centered on engineering and architecture evaluation at Arm headquarters in the United Kingdom, oriented to SoC design teams and systems architects rather than a formal enterprise procurement.
The activity is recorded as a joint demonstration rather than a production rollout, so adoption of specific Cadence Interconnect Workbench modules for Arm projects is inferred from the published demonstration material. Within Electronic Design,System on Chip Design toolchains, Cadence Interconnect Workbench is positioned as design stage instrumentation for interconnect performance analysis and architecture level PPA exploration.
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Renesas Electronics | Manufacturing | 22711 | $8.8B | Japan | Cadence Design Systems | Cadence Interconnect Workbench | Electronic Design,System on Chip Design | 2016 | n/a |
In 2016, Renesas Electronics deployed Cadence Interconnect Workbench in its SoC and MCU design flow in Japan to accelerate cycle accurate performance analysis and verification of on chip interconnects. The deployment positioned Cadence Interconnect Workbench inside Renesas Electronics' Electronic Design,System on Chip Design toolchain to centralize interconnect modeling and pre silicon validation workflows for system architects and verification engineers.
Implementation emphasized cycle accurate modeling, traffic generation, and verification automation capabilities native to Cadence Interconnect Workbench, configured to produce repeatable performance scenarios and to feed system level testbenches. Configuration work focused on transaction level stimulus generation and automated execution of performance scenarios to support SoC and MCU functional teams and verification groups.
Renesas integrated Cadence Interconnect Workbench with Cadence Palladium Z1 and vManager for testbench automation and system level performance validation, coupling software driven scenarios with hardware assisted emulation for end to end verification. The deployment reduced cycle accurate performance analysis from 22 to 9 days and improved verification execution speed by about 250x, outcomes documented in Cadence's Renesas success story.
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