List of Ansys HPC Customers
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Since 2010, our global team of researchers has been studying Ansys HPC customers around the world, aggregating massive amounts of data points that form the basis of our forecast assumptions and perhaps the rise and fall of certain vendors and their products on a quarterly basis.
Each quarter our research team identifies companies that have purchased Ansys HPC for Electromagnetic Field Simulation from public (Press Releases, Customer References, Testimonials, Case Studies and Success Stories) and proprietary sources, including the customer size, industry, location, implementation status, partner involvement, LOB Key Stakeholders and related IT decision-makers contact details.
Companies using Ansys HPC for Electromagnetic Field Simulation include: Continental, a Germany based Automotive organisation with 96426 employees and revenues of $46.60 billion, Hewlett Packard Enterprise, a United States based Professional Services organisation with 61000 employees and revenues of $30.13 billion, ST Microelectronics, a Switzerland based Manufacturing organisation with 51370 employees and revenues of $16.13 billion and many others.
Contact us if you need a completed and verified list of companies using Ansys HPC, including the breakdown by industry (21 Verticals), Geography (Region, Country, State, City), Company Size (Revenue, Employees, Asset) and related IT Decision Makers, Key Stakeholders, business and technology executives responsible for the software purchases.
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| Logo | Customer | Industry | Empl. | Revenue | Country | Vendor | Application | Category | When | SI | Insight |
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Continental | Automotive | 96426 | $46.6B | Germany | Ansys Inc. | Ansys HPC | Electromagnetic Field Simulation | 2024 | n/a |
In 2024 Continental deployed Ansys HPC to accelerate electromagnetic simulation for short-range radar used in ADAS and autonomous-vehicle sensor integration across Europe. The project combined Ansys HFSS and Ansys AVxcelerate Sensors with Ansys HPC and cloud resources to create a compute-scalable simulation environment, and this implementation falls under the Apps Category .
The implementation centered on Ansys HPC as the compute orchestration layer, provisioning high-performance node classes in the cloud to run large-scale HFSS electromagnetic solves and sensor-specific AVxcelerate simulations. Module usage included parallel solver execution, job queuing and scheduling on cloud-backed HPC instances, and automated pre- and post-processing workflows to handle multi-configuration vehicle integration scenarios.
Operational coverage targeted ADAS and autonomous-vehicle sensor integration engineering teams in Europe, focusing on electromagnetic performance validation, sensor placement studies, and absorber-material strategy evaluation. The configuration enabled iterative virtual prototyping across vehicle architectures, surfacing ghost-target scattering issues earlier in the design cycle and informing placement and material decisions.
Outcomes reported from the deployment included up to 18x faster simulations, reduced physical prototyping, and improved sensor placement and absorber-material strategies for vehicle integration. The use of Ansys HPC with cloud resources delivered measurable simulation throughput gains and revealed electromagnetic scattering behaviors that impacted integration planning, without introducing named third-party system integrations.
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Hewlett Packard Enterprise | Professional Services | 61000 | $30.1B | United States | Ansys Inc. | Ansys HPC | Electromagnetic Field Simulation | 2021 | n/a |
In 2021, Hewlett Packard Enterprise implemented Ansys HPC within Hewlett Packard Labs to enable an integrated electronic photonic co-simulation workflow for silicon photonics DWDM transceiver design. The deployment paired Ansys Lumerical and the Ansys Electronics full wave electromagnetic solver to orchestrate photonics and electronic multiphysics models across design phases. Apps Category .
Ansys HPC was used to scale full wave EM and multiphysics co-simulations, an inference based on the project requirement for large scale, full wave electromagnetic and multiphysics coupling, and this supported research and development activities in the United States. The work impacted R&D engineering teams by creating a unified simulation pipeline that reduced integration errors and improved R&D efficiency through coordinated solver execution and shared simulation datasets.
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ST Microelectronics | Manufacturing | 51370 | $16.1B | Switzerland | Ansys Inc. | Ansys HPC | Electromagnetic Field Simulation | 2020 | n/a |
In 2020, ST Microelectronics implemented Ansys HPC in the Apps Category to accelerate electromagnetic simulation workflows for semiconductor R&D. The deployment focused on high fidelity electromagnetic design and validation for 60 GHz V band contactless communications products using Ansys HPC.
The implementation combined the Ansys HFSS solver suite with upgraded Intel based on premises HPC nodes and Microsoft Azure burst capacity to enable antenna and package co design and validation. Ansys HPC was configured to run multi hundred case parametric sweeps and full wave simulations, with distributed job scheduling and hybrid on premises to cloud bursting to improve throughput and manage large simulation batches.
Operational coverage included Europe and global R&D teams within the semiconductor engineering organization, concentrating on design engineering, package engineering and system level verification functions. Integrations explicitly included Ansys HFSS workflows, Intel based on premises compute infrastructure and Microsoft Azure burst capacity to create a hybrid simulation pipeline that moved large jobs to cloud overflow when local capacity was saturated.
Governance and operational controls emphasized solver runtime configuration, job orchestration policies and controlled cloud bursting to protect intellectual property and manage compute consumption. The implementation delivered dramatic speedups in simulation throughput, shrinking multi hundred case runs from days to hours, shortening development cycles and reducing validation costs.
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