List of ASNSY SAF360x Customers
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Since 2010, our global team of researchers has been studying ASNSY SAF360x customers around the world, aggregating massive amounts of data points that form the basis of our forecast assumptions and perhaps the rise and fall of certain vendors and their products on a quarterly basis.
Each quarter our research team identifies companies that have purchased ASNSY SAF360x for System on Chip Design from public (Press Releases, Customer References, Testimonials, Case Studies and Success Stories) and proprietary sources, including the customer size, industry, location, implementation status, partner involvement, LOB Key Stakeholders and related IT decision-makers contact details.
Companies using ASNSY SAF360x for System on Chip Design include: Samsung Electronics, a South Korea based Manufacturing organisation with 262647 employees and revenues of $203.54 billion, NVIDIA, a United States based Manufacturing organisation with 36000 employees and revenues of $130.50 billion, Taiwan Semiconductor, a Taiwan based Manufacturing organisation with 65152 employees and revenues of $74.79 billion, NXP Semiconductors, a Netherlands based Manufacturing organisation with 34200 employees and revenues of $13.21 billion and many others.
Contact us if you need a completed and verified list of companies using ASNSY SAF360x, including the breakdown by industry (21 Verticals), Geography (Region, Country, State, City), Company Size (Revenue, Employees, Asset) and related IT Decision Makers, Key Stakeholders, business and technology executives responsible for the software purchases.
The ASNSY SAF360x customer wins are being incorporated in our Enterprise Applications Buyer Insight and Technographics Customer Database which has over 100 data fields that detail company usage of software systems and their digital transformation initiatives. Apps Run The World wants to become your No. 1 technographic data source!
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| Logo | Customer | Industry | Empl. | Revenue | Country | Vendor | Application | Category | When | SI | Insight |
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NVIDIA | Manufacturing | 36000 | $130.5B | United States | Ansys Inc. | ASNSY SAF360x | System on Chip Design | 2017 | n/a |
In 2017 NVIDIA deployed ASNSY SAF360x to support full chip SoC power integrity and reliability signoff for very large GPUs, establishing an engineering signoff capability in the Americas. The ASNSY SAF360x implementation maps to the Ansys Inc. RedHawk-SC and Totem SoC signoff family for full chip power and thermal analysis, and the project emphasized end to end power integrity and reliability workflows for GPU SoC designs.
The implementation used RedHawk-SC style capabilities for full chip power grid analysis, IR drop and electromigration checks, and reliability signoff, with inferred configuration of distributed compute for sub-24-hour turnaround on full chip analyses. ASNSY SAF360x was applied to power and thermal verification modules, automated signoff job orchestration, and silicon correlation workflows, producing close silicon correlation against silicon measurements as part of the verification loop.
Operational scope centered on engineering teams responsible for SoC power and thermal design, verification, and signoff within NVIDIA Americas, integrating into RTL to GDSII verification gates and design review checkpoints. The deployment relied on scalable compute topology typical of RedHawk-SC deployments to handle very large GPU die sizes, supporting parallel full-chip analysis and job queuing for continuous signoff cadence.
Governance changes included formalizing power integrity and reliability signoff gates and embedding ASNSY SAF360x driven reports into existing signoff workflows, enabling repeatable full chip checks before tape out. Outcomes explicitly stated include achieving sub-24-hour full chip analysis turnaround and close silicon correlation, reinforcing the implementation as a production SoC power and reliability signoff capability.
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NXP Semiconductors | Manufacturing | 34200 | $13.2B | Netherlands | Ansys Inc. | ASNSY SAF360x | System on Chip Design | 2015 | n/a |
In 2015, NXP Semiconductors used ANSYS simulation tools to design and validate the ASNSY SAF360x. The implementation targeted consolidation of six discrete radio chips into a single system-on-chip to support scalable multi-standard digital radio for automotive infotainment, within the Apps Category .
The ASNSY SAF360x development relied on ANSYS RedHawk and ANSYS Totem as core functional capabilities, delivering power noise and reliability sign-off validation. RedHawk and Totem were applied to model multiple noise sources, including substrate and IC package interactions, and to simulate noise coupling across circuits under real software operating conditions and silicon measurements.
Operational coverage centered on the automotive infotainment product line and NXP design methodologies central R&D, with engineering simulation inputs integrated into silicon validation and sign-off workflows. Test inputs combined software-driven operating scenarios with empirical silicon measurements to validate the single-chip SAF360x against interference and reception performance requirements.
Governance focused on production sign-off processes that incorporate simulation-driven validation, modeling of cross-circuit noise, and iterative verification prior to silicon release. Explicit outcomes reported include a reduced product footprint, improved infotainment system performance, and decreased costs associated with combining six chips into the ASNSY SAF360x system-on-chip.
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Samsung Electronics | Manufacturing | 262647 | $203.5B | South Korea | Ansys Inc. | ASNSY SAF360x | System on Chip Design | 2023 | n/a |
In 2023 Samsung Electronics certified and validated Ansys RedHawk‑SC Electrothermal for use with its X‑Cube multi‑die packaging technologies and mapped ASNSY SAF360x to SoC electrothermal signoff workflows, Apps Category . The deployment targeted foundry signoff and packaging validation, aligning the ASNSY SAF360x application with advanced package thermal and power verification for 2.5D and 3D‑IC products.
The implementation centered on electrothermal and power integrity analysis capabilities, using ASNSY SAF360x as an SoC signoff toolset for predictive thermal and power signoff. Functional capabilities implemented included chip and package level electrothermal simulation, multi‑die thermal coupling analysis, and signoff oriented power delivery network verification consistent with RedHawk‑SC Electrothermal workflows.
Integrations were executed into Samsung Foundry certification and X‑Cube packaging validation flows, with operational coverage focused on Samsung Foundry SoC engineering and packaging teams across Asia. The configuration and validation effort emphasized alignment between package thermal models and foundry signoff criteria, enabling consistent handoffs between design and manufacturing validation groups.
Governance changes concentrated on embedding electrothermal signoff checkpoints into existing packaging validation and foundry certification processes, and on formalizing simulation inputs and output artifacts for signoff reviews. The certification and validation of Ansys RedHawk‑SC Electrothermal through ASNSY SAF360x improved predictive thermal and power signoff accuracy for advanced multi‑die packages as stated in the validation notes.
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Manufacturing | 65152 | $74.8B | Taiwan | Ansys Inc. | ASNSY SAF360x | System on Chip Design | 2020 | n/a |
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