List of Siemens Symphony Pro Customers
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Since 2010, our global team of researchers has been studying Siemens Symphony Pro customers around the world, aggregating massive amounts of data points that form the basis of our forecast assumptions and perhaps the rise and fall of certain vendors and their products on a quarterly basis.
Each quarter our research team identifies companies that have purchased Siemens Symphony Pro for Process Simulation from public (Press Releases, Customer References, Testimonials, Case Studies and Success Stories) and proprietary sources, including the customer size, industry, location, implementation status, partner involvement, LOB Key Stakeholders and related IT decision-makers contact details.
Companies using Siemens Symphony Pro for Process Simulation include: ST Microelectronics, a Switzerland based Manufacturing organisation with 51370 employees and revenues of $16.13 billion, Toppan, a Japan based Professional Services organisation with 54336 employees and revenues of $7.87 billion, Silicon Labs, a United States based Manufacturing organisation with 1889 employees and revenues of $584.0 million and many others.
Contact us if you need a completed and verified list of companies using Siemens Symphony Pro, including the breakdown by industry (21 Verticals), Geography (Region, Country, State, City), Company Size (Revenue, Employees, Asset) and related IT Decision Makers, Key Stakeholders, business and technology executives responsible for the software purchases.
The Siemens Symphony Pro customer wins are being incorporated in our Enterprise Applications Buyer Insight and Technographics Customer Database which has over 100 data fields that detail company usage of software systems and their digital transformation initiatives. Apps Run The World wants to become your No. 1 technographic data source!
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| Logo | Customer | Industry | Empl. | Revenue | Country | Vendor | Application | Category | When | SI | Insight |
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Silicon Labs | Manufacturing | 1889 | $584M | United States | Siemens | Siemens Symphony Pro | Process Simulation | 2022 | n/a |
In 2022, Silicon Labs implemented Siemens Symphony Pro to support mixed signal verification for analog intensive IoT system on chips within a Process Simulation context. The deployment was based in the United States and targeted engineering and SoC verification teams responsible for analog and mixed signal IP verification.
Silicon Labs used the Siemens Symphony Pro mixed signal verification platform and Siemens Symphony Pro Visualizer as a sign off solution, extending an expanded digital verification methodology into analog verification flows. Implementation focused on simulation driven debug, coverage closure workflows, and visualization based sign off, leveraging Symphony Pro capabilities for interactive debug and coverage analysis.
Operational scope encompassed analog intensive IoT SoC projects and associated verification groups, integrating Symphony Pro into existing verification pipelines to centralize debug and coverage reporting. Governance shifted to Visualizer based sign off, creating a formalized sign off gate and standardized coverage closure criteria across the SoC verification lifecycle.
The company reported debug turn around improvements from days to hours and cited improved coverage closure as objectives achieved during the deployment, as described in the Siemens press release about Siemens Symphony Pro. Siemens Symphony Pro remains the stated verification and visualization platform for Silicon Labs mixed signal verification work.
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ST Microelectronics | Manufacturing | 51370 | $16.1B | Switzerland | Siemens | Siemens Symphony Pro | Process Simulation | 2022 | n/a |
In 2022, ST Microelectronics Imaging Division participated in the Siemens Symphony Pro early access program to accelerate mixed signal functional verification for imaging and automotive SoCs. ST Microelectronics used Siemens Symphony Pro to exercise multi layer sandwich configurations aimed at addressing complex verification stacks within its imaging verification workflows in Europe.
The engagement used Siemens Symphony Pro, a Process Simulation application, to validate multi layer sandwich verification architectures and to drive mixed signal functional checks across imaging and automotive SoCs. The Siemens press release cites the ST Microelectronics senior CAD manager describing measurable verification productivity improvements and significant productivity gains from those multi layer configurations.
Operationally the implementation was scoped to the Imaging Division verification engineering teams and aligned with project level verification cycles for imaging and automotive SoC development. Governance followed an early access program cadence with senior CAD engineering oversight to iterate on configuration tuning and to capture verification process learnings for potential broader adoption.
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Toppan | Professional Services | 54336 | $7.9B | Japan | Siemens | Siemens Symphony Pro | Process Simulation | 2025 | n/a |
In 2025, Toppan implemented Siemens Symphony Pro for Process Simulation. The deployment targeted mixed signal verification for a complex CMOS image sensor, presented by Toppan at a Siemens EDA Forum in Japan where the team reported Symphony reduced verification time by more than 50 percent and improved full chip verification throughput for imaging applications. The Siemens blog references Symphony as the mixed signal platform used, and the use of Siemens Symphony Pro is inferred from the customer presentation.
The implementation leveraged Siemens Symphony Pro mixed signal simulation engine, testbench orchestration and regression management capabilities typical of Process Simulation platforms, enabling combined analog and digital stimulus cycles and hierarchical full chip runs. Configuration work emphasized automation of mixed signal regression campaigns, reuse of verification IP, and waveform based assertion checking to accelerate iteration cadence.
Operational scope centered on Toppan engineering and imaging verification teams in Japan and aligned with CMOS sensor verification flows. Integrations focused on tooling handoffs, verification data exports to engineering data repositories, and linking verification artifacts into design management workflows to preserve traceability across test vectors and results.
Governance and workflow changes formalized centralized mixed signal regression scheduling and standardized verification workflows to support repeatable full chip verification cycles. The customer presentation and Siemens documentation explicitly cite the observed outcome of reduced verification time and improved throughput for imaging applications.
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